Kauai, Hawaii, February 2, 2014 – ReMAP is pleased to announce the network’s first research project presented at the SMTA Pam-Pacific Symposium earlier this month in Kauai, Hawaii. Authored by Professor Boxin Zhao, Wei Zhang, Behnam Meschi Amoli and Jeffrey d’Eon, University of Waterloo and Alex Chen, Celestica Inc., the Application of Novel Polydopamine-Polypyrole Nanofibers for Electrically Conductive Adhesives was presented at the SMTA Pan-Pac symposium.
“This is a great step towards our vision – as products are being launched exponentially faster than ever before, the role of the ReMAP network is to accelerate time-to-market from researchers’ innovative ideas and emerging technologies through to product commercialization,” said , Irene Sterian, Executive Director, ReMAP. “ReMAP leverages federal funding from the Business-Led Networks of Centres of Excellence program matched by industry partner investments to enable product collaborations like this one between the University of Waterloo, Celestica and Microbonds to support electronics innovations developed in Canada.”
Electrically conductive adhesives (ECAs) offer many advantages such as lower processing temperature, simpler processing steps and finer-pitch interconnection in comparison with the traditional soldering technology. However, due to the poor metallurgical connections of silver flakes in the ECA network, it requires a large amount of silver or other metallic fillers to achieve high conductivity, which is not cost-effective for industrial applications. In this work, we present the utilization of a novel type of dopamine-functionalized polypyrrole (DA-PPy) nanofibers to develop a hybrid nanocomposite adhesive with lower metallic content. Compared to conventional ECAs, the hybrid ECAs displayed significantly higher electrical conductivity. In particular, the introduction of 3 wt% nanofibers into a conventional ECA with 57.9 wt% silver flakes resulted in high electrical conductivity of 2400 S/cm, which was comparable to that of ECA filled with 80 wt% silver flakes. Read Application of Novel Dopamine-Polypyrrole Nanofibers for ECAs.
About SMTA Pan Pac
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. Pan Pac provides the latest research on Failure Analysis Tools and Techniques, Strategic Directions (Plenary), 3D Structures, Advanced Materials, Advanced Manufacturing Challenges, Trends, Roadmaps, etc.