First ReMAP Project Presented at the 2015 SMTA Pan-Pacific Symposium
Kauai, Hawaii, February 2, 2014 – ReMAP is pleased to announce the network’s first research project was presented at the SMTA Pam-Pacific Symposium earlier this month in Kauai, Hawaii. Authored by Professor Boxin Zhao, Wei Zhang, Behnam Meschi Amoli and Jeffrey d’Eon, University of Waterloo and Alex Chen, Celestica Inc., the Application of Novel Polydopamine-Polypyrole Nanofibers for Electrically Conductive Adhesives was presented at the symposium.
Electrically conductive adhesives (ECAs) offer many advantages such as lower processing temperature, simpler processing steps and finer-pitch interconnection in comparison with the traditional soldering technology. However, due to the poor metallurgical connections of silver flakes in the ECA network, it requires a large amount of silver or other metallic fillers to achieve high conductivity, which is not cost-effective for industrial applications. In this work, we present the utilization of a novel type of dopamine-functionalized polypyrrole (DA-PPy) nanofibers to develop a hybrid nanocomposite adhesive with lower metallic content. Compared to conventional ECAs, the hybrid ECAs displayed significantly higher electrical conductivity. In particular, the introduction of 3 wt% nanofibers into a conventional ECA with 57.9 wt% silver flakes resulted in high electrical conductivity of 2400 S/cm, which was comparable to that of ECA filled with 80 wt% silver flakes.
About SMTA Pan Pac
The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. Pan Pac provides the latest research on Failure Analysis Tools and Techniques, Strategic Directions (Plenary), 3D Structures, Advanced Materials, Advanced Manufacturing Challenges, Trends, Roadmaps, etc.
Date: February 02-05/2015
Venue: Sheraton Poipou Resort
2440 Hoonani Rd, Koloa, HI 96756, United States