Please join ReMAP and our partners at the SMTA International Technical Conference, which will be held at the Donald Stephens Convention Centre in Rosemont, Illinois from September 27 to October 1.
2014 Best International Paper
It is our pleasure to announce that two of our partners, Celestica’s Polina Snugovsky, Ph.D., and BAE Systems Stephen Meschter, Ph.D., will be recognized at this year’s conference for the SMTA 2014 ‘Best International Paper’ award. Dr. Snugovsky and Dr. Meschter will be honoured for their research paper, ‘Strategic Environmental Research and Development Program Tin Whisker Testing and Modeling: Tin Whisker Growth on SAC305 Assemblies’ presented at last year’s conference.
Monday, September 28, 2015
Alex Chen, Celestica Inc. will chair the Wearable Electronics Technology Development seminar 1:30 pm to 3:00 pm. This session will focus on a range of topics including Smart Textiles for Wearable Technology.
Please join Irene Sterian, Executive Director, ReMAP for the Evolving Technologies panel discussion from 3:30 pm to 5:00 pm. Panel experts will present their key technology insights in 3D Packaging Technology Trends, Renewable Energy, Optics & Photonics, Wearable Electronics and Next-Gen PCBs for Embedded Technologies. Beer & Pretzels will be served!
Tuesday, September 29, 2015
Celestica’s John McMahon, P.E., will chair the Challenges in Advanced Package on Package (PoP) Applications session from 2:00 pm – 3:30 pm. This session highlights some of the challenges and solutions associated with the advances in PoP applications.
Wednesday, September 30, 2015
Jason Keeping, P.E., Celestica Inc. will chair the Ruggedization Technologies & Materials to Meet Today’s Electronic Requirements panel discussion from 10:30 am – 12:00 pm. This session shares recent work done on upstream processes as well as material and application developments for ruggedization.
John McMahon, P.E., Celestica Inc. will join the Solder-Joint Reliability session from 2:00 pm – 3:30 pm. The session will explore the effects of a variety of package types, package sizes and solder alloy composition on the solder-joint lifetime in temperature cycle testing. John will present, ‘A Selected Comparison from ATC Test: Industry Progress from 2005 to Present’.
Thursday, October 1, 2015
Jeff Kennedy, Celestica Inc. and SMTA Board Member will chair the Tin Whiskers and Mitigation session from 1:00 pm – 2:30. This session will explore the latest research initiatives including mitigation of tin whiskers as well as some novel material developments using Nano-particles in conformal coating. Polina Snugovsky, co-author of the ‘SERDP Nano-particle Enhanced Conformal Coating Project: Modeling for Tin Whisker Mitigation’ will participate in this session.
If you want to get the latest research to help you reduce defects and control your processes, then look no further than the SMTA International Technical Conference. SMTAI has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry. This year in Rosemont, we are offering new session tracks including Flux, Solder, Adhesives (FSA) and Inspection Technologies (INS).
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Date: August 21/2015
Venue: Donald Stephens Convention Centre
9291 Bryn Mawr Ave, Rosemont, IL 60018, United States