Meet ReMAP at the 2017 Surface Mount Technology Association (SMTAi) International Technical Conference & Electronics Exhibition. At this SMTA event, business leaders from around the world meet to gain insight on how to reduce defects and control manufacturing processes with the latest technologies. During this five-day conference and exhibition, we will join sessions on Advanced Packaging Technology; Flux, Solder, Adhesives; Inspection Technologies; Manufacturing Excellence; and Substrates/PCB Technology. Be at the Symposiums to hear the latest research on Harsh Environments, Technical Innovations, and Lead-Free Soldering Technology.
Please join Irene Sterian, President & CEO, ReMAP for the Technical Innovations panel discussion on September 18th, from 3:30 pm to 5:00 pm. Panel experts will present their key technology insights in 3Dackaging Challenges, Optics & Photonics, Lead-Free Current/Future and What’s new in Electronics.
ReMAP has the following recognized leaders in electronics participating at SMTAi:
Jeff Kennedy, Director of Technology, Celestica
SMTA Board of Directors, President
Thilo Sack, Principal Engineer: Research & Development, Celestica
Factory Automation Panel
Jason Keeping, P. Eng., Corporate Advanced Process Development, Celestica
Co-chair, Conformal Coating Panel, Celestica
Andre Delhaise, Metallurgist, Celestica
Readying Pb-Free Innovations for High-Reliability Electronics
Geoffrey Rivers, Chemical Engineering, University of Waterloo
Poster: Nanomaterial-Enhanced Electronically Conductive Adhesives
ReMAP is pleased to have members of our Technology Committees present at SMTAi.
Reza Ghaffarian, Ph.D., Jet Propulsion Laboratory
Chair, Technical Innovations Panel
S. Manian Ramkumar, Ph.D. Rochester Institute of Technology (RIT)
Reflow Soldering Process and Influence on Defects
Ning-Cheng Lee, Ph.D. Indium Corporation
Novel Solder Alloy with Wide Service Temperature, Capability for Automotive Applications
Matt Kelly, P.Eng. IBM Corporation
BTC Leadless – Design for Excellence
Co-Chair, Advanced Packaging
About SMTAi Conference & Exhibition
The SMTAi Conference and Exhibition gathers businesses and innovators from around the globe to a 5-day long event featuring presenters and businesses that are shaping the future of electronics assembly. With informative keynotes and the opportunity to explore the most recent advancements in manufacturing technologies in the live exhibit, the SMTAi conference and exhibition allows attendees to remain at the forefront of the industry.
The SMTA is an international network of professionals who work together to build skills, share practical experience and develop real world solutions in electronic assembly technologies including microsystems, emerging technologies and related business operations. Offering access to local and global communities of experts, the SMTA has accumulated research and training materials to dedicate itself towards advancing the electronics industry
Date: September 17-21, 2017 (Conference), September 19-20 (Exhibition)
Venue: Donald Stephens Convention Centre
Address: 5555 N River Rd, Rosemont, IL 60018, USA