The advancement of nanomaterials has created an opportunity to expand electronics beyond traditional solders to bendable, flexible adhesives. Together with the University of Waterloo, Microbonds, Celestica, Engage Biometrics, and Juniper are developing nanomaterials for electrically conductive adhesives (EDAs).
ReMAP M4 Electrically Conductive Adhesives ECAs focuses developing ECA materials that support larger process windows, higher density interconnects and electronics miniaturization.
At this years AGM, InsightaaS.com examined the future of ECAs for electronics manufacturing and here is what they had to share.
ReMAP M4 Electrically Conductive Adhesives ECAs
To enable electrical connections where traditional alloy solders are not feasible – for example, in flexible, bendable electronic assemblies – the ECA team is using nanomaterials, which offer several tech benefits: they offer 200 percent better connectivity than other materials and are the lowest cost while delivering the highest strength and longest shelf life. Additionally, ECAs can adhere to more than metal, and hence can be used in additive printing, an unintended but beneficial market advantage. The Project 04 team represents a collaboration between the University of Waterloo, Microbonds, Celestica, Engage Biomechanics and Juniper Networks. (a Commercialization 2017 finalist) Used with permission- See full article here.
Find out more about ReMAP’s award-winning collaborations between Canadian innovators.
Managing the Information Tsunami– ReMAP 08 was a ReMAP Commercialization Prize Finalist, 2017
Advancing Optical Applications – ReMAP 07 received the first ReMAP Global Impact Award, 2017.
Disrupting the Industrial Sensing – ReMAP 011 the recipient of the $50K ReMAP Commercialization Price, 2017.
Advancing Fibre-Optic Sensing Solutions – ReMAP 010 is celebrating entry into the Global Market.