Event: SMTA International 2016

September 26, Rosemont, IL. Please join ReMAP at SMTA International 2016, a showcase of the world’s leading research in advanced packaging, inspection technologies, and manufacturing. The conference will be held on September 26 to 29 at the Donald Stephens Convention Center Rosemont, IL. The Sensors Midwest 2016 conference is co-located with SMTA International.

Conference Overview:If you want to get the latest research to help you reduce defects and control your processes, then look no further than the SMTA International Technical Conference. SMTA has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry. This year, SMTA will offer new session tracks including Flux, Solder, Adhesives (FSA) and Inspection Technologies (INS). Visit http://www.smta.org/smtai/at_a_glance.cfm for an overview of all the SMTA sessions.

‍Conference Highlights: Excellence in International Leadership AwardReMAP is pleased to announce Jason Keeping, Celestica will be recognized by SMTA with the Excellence in International Leadership Award at this year’s conference. SMTA honours members who stand out as strong leaders in the Association. Congratulations Jason!

‍Monday September 26

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High Temperature Novel Materials and Processes for Automotive Applications

‍Co-Chair: John McMahon, CelesticaAt SMTA, John will co-chair the High Temperature Novel Materials and Processes for Automotive Applications Seminar. This session parents research work on new lead-free materials for power applications and high temperatures above 250 degrees Celsius. Works on silver sintering method of packaging power electronic modules will also be discussed, specifically details of the sintering materials.

‍Component reliability and Prognostic Health Management for Harsh Environments panel

‍Chair: Polina Snugovsky, CelesticaThis Component Reliability and Prognostic Health Management for Harsh Environmentspanel will be chaired by ReMAP partner Polina Snugovsky. Polina is a leading force in the scientific community. In the 2014 SMTA International Conference she was recognized with the “Best International Paper” award for her research on tin whisker growth in strategic environments. Various applications of electronics in harsh environments have motivated a demand for fine pitch assemblies and pb-free electronics. Polina’s panel will articulate and quantify the manufacturing and sustainment of electronics in harsh environments.

‍Evolving Technologies Panel

‍Panellist: Irene Sterian, ReMAPThe Emerging Technologies Panel is a central focus of the SMTA Conference that culminates the several works of innovation and ideas in the Emerging Technologies Symposium. Irene Sterian, Executive Director of ReMAP, will share ReMAP insights in this session as one of the expert panellists. The panel will cover key innovations including advancements in lead-free new alloys, 3D Packaging Technology Trends, embedded active/passive technologies, Optics, Photonics, Sensors and the next generation of emerging technologies.

Tuesday September 27

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Training SessionsChair: Zenaida ValianuPlease join Zenaida Valianu,Celestica as she co-chairs two IPC Training Committees: J-STD-001 Technical Training Committee on Tuesday, September 27 and the IPC-7711/21 Technical Training Committee on Wednesday, September 28.

‍Wednesday September 28

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‍Reflow and Soldering Technology: ChallengesCo-chair: Jeff Kennedy, CelesticaHandling unique process requirements in the reflow process requires specific process manipulations to be successful. This session shares three challenges associated with mixed component reflow, LED soldering, and process tuning for better reflow process performance.Solder - Part 2Project Update: Protocol Development for Testing Solder Reliability in Combined EnvironmentsPanellists: Polina Snugovsky, Jeffrey Kennedy and John McMahon, Celestica During the Solder - Part 2 session, John McMahon, Polina Snugovsky and Jeffrey Kennedy who will co-present Protocol Development for Testing Solder Reliability in Combined Environments.

‍Thursday September 29

‍Cleaning: New TechniquesChair: Jason Keeping, CelesticaJason Keeping, Celestica will chair the Cleaning: New Techniques. Increased complexity and miniaturization of electronic assemblies lines along with demanding end use requirements in situations where cleaning was previously not required. Panellists will discuss variables and challenges in the assembly process that impact cleaning. Furthermore, this session will explore new technologies and innovations in the cleaning process that can increase product reliability.Cleaning: Low Clearance ChallengesChair: Jason Keeping, CelesticaJason Keeping, Celestica will chair Cleaning: Low Clearance Challenges. This session explores the challenges with tight z-height components and how to handle cleaning these assemblies to gain good product level reliability

.About SMTA:The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.