ReMAP Announces Commercialization Prize Winner at 2017 AGM

Toronto, Canada, June 22, 2017 –  ReMAP is pleased to announce that the winner of the 2017 Commercialization Prize was awarded to ReMAP O11 at its AGM in Toronto on June 20th. Winners, Fibos, Celestica and Ryerson University, the ReMAP O11 team, worked together to advance optical gauge amplifier technologies. This collaboration consists of industry leaders and top-notch researchers in optics and photonics. Moving forward, they will continue to focus on the development of sensors that are safe, measure accurately and perform well in extreme and hazardous environments such as those in the oil and gas sector.The Commercialization Prize recognizes the project team with the most compelling business case to accelerate their innovation with an additional $50,000 of funding in 2017 – 2018. ReMAP O11 will leverage additional funding to advance a competitively priced optical sensing platform. The development of this innovation will enable customers to acquire knowledge in environments previously unreachable.

“Engaging with all stakeholders in the Product Enablement Value Chain, industry experts and scientists, strengthens the ability of a start-up organization to accelerate the commercialization of their innovation developed in Canada for the global market.  ReMAP is pleased to support the ReMAP O11 Team in this initiative", said Irene Sterian, President & CEO, ReMAP.

Also recognized at the AGM were the ReMAP O7, ReMAP O8 and ReMAP M4 Projects.The $10,000 Global Impact Award was awarded to ReMAP O7. ReMAP O7 is a collaboration between 7D Surgical, Celestica, Ryerson University and Sunnybrook Research Institute to advance optical technologies for image-guided surgery.In addition to the Global Impact Award, two Commercialization Finalists, ReMAP M4 and O8 were each presented with a $5,000 Prize. The Project M4 (Electrically Conductive Adhesives) Team brought together, University of Waterloo, Microbonds, Celestica, Engage Biomechanics and Juniper Networks. They are developing Electrically Conductive Adhesives (ECAs) using nanomaterials as an alternative to traditional metal alloy solders. ReMAP O8's, Indium Phosphide High Speed Modulator is being developed by Ciena, in collaboration with McGill University, CMC Microsystems and Celestica for the ICT sector. These awards will provide additional funding to enable business development, travel to trade shows, conferences and/or potential customer visits to demonstrate their product innovation.