Developing Electrically Conductive Adhesives (ECAs) using nanomaterials is an alternative to traditional solders. Traditional solders are limited in reflow temperatures and particle size, rendering them restricted to a set pitch and temperature.
ECAs can bind at lower temperatures – reducing the risk of stress while maintaining product reliability. ECAs also enable higher density interconnects due to the structure of the material.
This project is focused on developing ECA materials that support larger process windows, higher density interconnects and electronics miniaturization.