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O14 Fiber Attach Strain Relief for Photonic Device Packaging

Enabling high-throughput assembly lines for photonic packaging can dramatically improve cost and scalability of photonic devices. Self-alignment structures can be used to achieve the micron range alignment required by single-mode optics on the photonic device despite the lower high-throughput tools placement accuracy of typical 10 um. The optical interconnection also neesd to withstand stresses both from package thermal incursion, notably at solder reflow, and from the MT interface connector.

This project leverages existing microelectronic assembly infrastructure for optical packaging. This is a path to large scale and low cost manufacturing for photonic packages. One process involves the automated placement of a 12 fiber stub, with self-alignment, into a photonic device’s v-grooves. This optical interconnect is subjected to significant stresses during thermal excursions arising from downstream assembly processes, environmental stress testing, and during the plugging in and out of the MT interface connector. This project is focused on developing a strain relief method for an automated fiber attach technique in order to achieve the necessary reliability and optical performance as well as paving the way for a solder reflowable photonic package.

PUBLICATIONS

Year 4

A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities
Optical Interconnects
Optical Interconnects

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  • Home
  • Smart Manufacturing
  • News
  • About Us
  • Portfolio
    • New Materials
      • M1 Lower Temperature Soldering Alloys
      • M2 Tin Whiskers
      • M3 Aging
      • M4 Electronically Conductive Adhesives
    • Optics/Photonics
      • O1 Optical Interconnects
      • O3 Monolithically Integrated Laser Materials on Silicon
      • O4 Integrated OCT System
      • O7 Optically Guided Laser Ablation with Integrated Surgical Navigation System
      • O8 Indium Phosphide High Speed Modulator
      • O9 Fibre Optic Sensors for Power Transformers
      • O10 Fibre Optic Sensors for Harsh Environment Monitoring
      • O11 Optical Sensing Solutions for New Markets 
      • O12 Field Ready Electrochemical Detector for Water Analysis
      • O14 Fiber Attach Strain Relief for Photonic Device Packaging
    • Renewable energy
      • S1 Smart Lamination Materials
      • S2 Enhanced Encapsulant
      • S3 Smart Electronics
      • S4 Solar Windows
      • S5 Next Generation Renewable Power Transformer
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